Author　　　　　　No.Page

Electronics & Packaging

Vol.15，No.1～12 Contents Index（2015）

AuthorNo.Page

Packaging&Assembly&Testing

The Future Technology Trends of Integrated Circuit Packaging and Testing Industry and Its Development in China ZHOU Zheng1（1）

Small Pitch High Reliability CQFN Ceramic Encapsulation Shell TechnologyYU Yongmei1（6）

Research of TLP Test Method for WaferZOU Qiaoyun，JIANG Rudong1（10）

Parallel Seam Welding for Glass Insulator Metal Pipe Shell Crack Impact Study XUE Jingjing， LI Shousheng， HOU Yuzeng2（1）

Assessment of Seam Quality in Parallel Seam Welding ProcessXIAO Hanwu2（5）

Effect of Electrical Erosstalk Frequency in Parameter Control Monitor LI Xinghe， JIANG Dawei， CHEN Peicang2（12）

Dynamic Parameter Test of High-speed DAC Embedded in DDS ZHANG Kaihong， CHEN Zhen， WANG Jianchao2（16）

A Test Pattern Based on Sample Rate of Serial Communication Interface ZHANG Ji， YANG Mengxi， XIE Da2（19）

A Study of Thermal Effects on Parallel Seam Sealing Process LI Zongya， CHEN Tao， TONG Liangyu， XIAO Hanwu3（1）

Research of Die Attach Adhesive Bleed out in Ceramic PackagingGE Qiuling， CHEN Tao3（5）

Parametric Simulation of the Thermal Property of Polymer-based Composite Packaging Materials WANG Wenzhi， ZHENG Peng， ZHOU Jijun， ZHENG Liang， QIN Huibin4（1）

The Influence of Gold-Tin Eutectic-welding Voids on the Thermal Resistance of Ceramic Package LI Lianghai， TONG Liangyu， GE Qiuling4（5）

The Technology Research of CSOP Type Ceramic Small Shape ShellYU Yongmei4（9）

Research on Structure of Corrugated Diaphragm in Pressure Sensor Packaging WANG Junjie， QIN Huibin5（1）

Test Pattern Analysis of SRAM Dynamic Parameter ZHANG Ji， LUO Ximing， WANG Jun， TANG Li， ZHANG Yibo5（4）

Research Status and Perspective of CoF Package Technology for LCD Drive IC HU Zhangqi， WANG Jian， GUO Han， CHEN Yu， CUI Chengqiang， WANG Fengwei， CAI Jian6（1）

Study on Multi-pin Glass-to-metal Seal by Transition Matching REN Lina， ZHANG Jianxun， JU He6（9）

Vertical Interconnection Techniques Based on LTCC Fuzz-button SI Jianwen， XU Li， WANG Ziliang6（13）

The Principle and Influence Factors of the Thermal Resistance of Power MOSFET Device KANG Xi'e6（16）

Analysis for the Application of Plastic Encapsulated Micro-circuit in Military Electronic Equipments LI Run7（1）

Study on the Reliability of Different Component of BGA Solders Interconnections under the Thermal Fatigue Loading BAO Cheng， XU Xing， CHENG Mingsheng7（5）

Research on Configuration Files of FPGA Based on the ATEZHAO Hua， ZHANG Huibin7（10）

Development of Micropackage Technology for Through Silicon Via （TSV） Interposer LIU Xiaoyang， LIU Haiyan， YU Daquan， WU Xiaolong， CHEN Wenlu8（1）

Finite Element Analysis of Effects of Cover Plate Structure on Residual Stress of Device in Sealing Test Process ZHAO Bo， GUO Huaixin， CHENG Kai， WANG Ziliang8（9）

To Judge and Analyze nA Level Electric Leakage of Probe CardsGU Ji， CHEN Haibo8（13）

CLB Module Testing Technology of SRAM-based FPGA WANG Jianchao， LU Feng， GU Weimin8（17）

Simulation of Differential Signal Transmission Characteristics of the Soldered Ball and Copper Interconnect in Flip Chip Package MENG Zhen， ZHANG Xingcheng， LIU Mou， TANG Xuan， YAN Yuepeng9（1）

Seal-weld Experiments and Analysis of SA Lead-free Solder JointHAI Yang9（6）

Package Temperature Effect Study of the Parallel Seam Sealing Process XU Yang， LI Maosong， NI Qianfeng9（10）

Integrated Circuit FT and High Voltage Test Method Research YAO Rui， ZHOU Chun， ZHANG Yajun， NI Xiaoli9（14）

Exploration of Multi SITE Efficient Test for LED Driven Class ICHAN Xinfeng9（17）

Thermal Simulation of FC-PBGA644 Package SHI Lei， HUANG Jinxin， MIAO Xiaoyong， WANG Honghui10（1）

Case Studies on Delamination of Plastic Packaging Device WU Xiaoliang， ZHOU Xuewei， FANG Yuan10（4）

Discussion on Test Method of Integrated Analog SwitchWEI Jun10（8）

Research of the Proficiency Testing for the Bond Strength Test YANG Cheng， WANG Bochun， TAN Chen， ZHANG Ji， MA Qingtao， PAN Lingyu11（1）

Effect and Analysis of Defects on the Mechanical Reliability of Ceramic Packaging ZHANG Jinli11（5）

A Way of Testing PAE of Pulse Power Amplifier Based on PNA-X CHENG Jinyuan， LI Zhiqun， QIAN Feng， JIAO Fang11（10）

Based on the Motor Driver Chip Scan Test Implementation CHEN Zhen， ZHANG Kaihong， WANG Jianchao11（14）

The Research of FPGA Routing Resources Testing Technology Based on VIRTEX Architecture WANG Jianchao， LU Feng， ZHANG Kaihong11（17）

The Analysis of Large Die Surface Delamination on Full Packaged Power Device SHI Haizhong， MIAO Xiaoyong， HE Xiaoguang12（1）

Study of Light Extraction Improvement of COB LED with Glass BoardSHEN Yafeng12（3）

The Exploration of LDO Class IC Output Voltage Test and Fuse Trimming MethodWU Xiwen12（8）

Research on Testing Technology of High Speed ADCGUO Xiaoyu12（12）

IC Design

Large Inductance Value PCB Planar Inductor Design Using Magnetic Substrate MENG Zhen，LIU Yanchun，ZHAO Wenying，HUANG Mian，YAN Yuepeng1（14）

Design and Implementation of 3DES Algorithm IP-core Based on AMBA Bus WANG Li， ZHANG Ling， QU Lingxiang1（19）

A Low-Power Dissipation BGR without Resistor and Operational Amplifier Based on 0.18 μm Process LI Yanxia， GONG Min， GAO Bo1（24）

Ethernet Test and Verification System Based on 82551 ZHANG Rong， XU Xiaobin， LUO Sheng， ZHANG Guoxian， PANG Lipeng1（28）

An Efficient Design Methodology for Gearbox Circuits in 10 Gbps Ethernet Transceiver HUANG Anjun， LUO Yang， LEI Shulan1（31）

A Bandgap Voltage Reference with No Op-amp and Low PowerZOU Qinli， TANG Ye2（22）

Design of a High-performance Clock BufferOUYANG Xue2（25）

Design of a USB Power Switch on Over Current OperationGUAN Yuanqian， GUAN Hongyun2（29）

New High-distinguish CMOS Current ComparatorCHENG Liang2（33）

High-precision Sub-threshold CMOS Voltage Reference with PVT Invariant WU Yao， GONG Min， GAO Bo3（9）

The Test and Verify of Radiation-hard Standard Cell Library XU Dawei， YAO Jin， HU Yongqiang， LIU Yongcan， ZHOU Xiaobin， CHEN Ju3（14）

An Improved Anti-collision Method for Identification of RFID Tag WANG Bin， LI Junjie， ZHANG Haipeng， CHEN Ziling， WANG Lidan3（18）

One Improved CORDIC Algorithm of Calculating 32 bit Floating the Arctangent Functions with FPGA BAO Yipeng3（22）

Design of a Hysteresis ComparatorXUE Tengfei， ZHU Jiang， QIAO Ming3（26）

A Design of Circuit of Generating sin/cos Signals with Double Modes Based on DDS BAO Shenghui， QIANG Xiaoyan， LIU Taiguang4（14）

Simulation Design of Line Scanning AFC PLL Circuit Based on MultisimLi Hong'en4（17）

Gate Sizing to Radiation Hardened for Single-event Transients in Digital Logic TIAN Haiyan， ZHOU Xiaobin， CHEN Ju4（20）

Full-custom Layout Design of High-precision Pipelined ADCLIU Li4（23）

Data Transfers by EDMA in Video Image Processing System CHEN Zhenjiao， XU Xinyu， ZHANG Menghua4（28）

The Design Database Technology of LTCC Microwave Components XIANG Wei， LI Jianhui， LI Tiancheng5（7）

Research and Application of the Validation Method of Static Random Access Memory for Space Application XIAO Aibin， WANG Feiyao， WANG Wenyan， JUAN Yang， ZHANG Leihao， ZHANG Haoyuan5（14）

A Technology of Flash Programming to TMS320F2812 Based on CAN Interface JIANG Jiongwei， QIAN Hao， YU Peng5（21）

Design of Wide Dynamic Variable Gain Amplifier GUO Anqiang， LIU Qianqian， JIN Yamei， WANG Zhiwei5（24）

Design of a High Precision Over-temperature Protection CircuitHUANG Junjun， QIAO Ming6（19）

Design and Implementation of USB 2.0 Device Function Verification Platform Based on VMT JIN Junxiao， WANG Yajun， HUANG Pu， YU Zhiguo， GU Xiaofeng， YU Zongguang6（23）

A 5-bit 4 GS/s Interpolation ADCPENG Yong， LU Xiang， TANG He6（28）

Design of Class D Power Amplifier with Output Power AdjustmentZHI Shengwu7（14）

Monolithic Equalizer Design Using GaAs MMIC TechnologySHEN Yiming， ZHANG Junzhi7（17）

Study of the Radiation-hard 0.8μm SOI CMOS Process Radiation Influence MA Huihong， GU Aijun7（20）

Research of Divided RESURF HVI StructureZHANG Xin， QIAO Ming7（24）

Design of a Communication Circuit Based on DALI ProtocolWAN Qing， HU Nanzhong7（28）

Power Nets Design for SoCZHANG Ling， WANG Li8（21）

Design and Implementation of Slave Mode of USB2.0 Device Interface Chip JIN Junxiao， WANG Yajun， ZHAO Linna， YU Zhiguo， WEI Jinghe， GU Xiaofeng8（25）

Research on Non-adaptive Routing Algorithm in NoC LI Tianyang， PAN Nengzhi， QV Lingxiang8（29）

Fault-tolerant Routing Algorithm of NoC QV Lingxiang， LIU Haipeng， PAN Nengzhi， ZHAO Baogong9（21）

2.4 GHz High Gain and Super-Low-Noise Amplifier Design LUO Bing， ZHAN Zhongshan， ZHANG Yongliang， QIU Wenhua， WANG Xirui9（24）

A Sample/Hold Circuit for Pipelined ADCsZHU Xiaoyu， JV Shuirong， SHI Qiaolin， LI Hua9（29）

A Design of C-band DROZHUANG Xude9（33）

A Design of RF Transceiver Front-end Signal Processing System Base on FPGA GOU Huanmin， ZHI Min10（12）

FPGA-based Imitate RF in the Application of ASIC Prototyping System SHANG Yang， WANG Qianzhu10（16）

Design and Verification of MAC Layer Based on PCIe Bus WANG Li， WANG Lei， ZHANG Ling10（20）

Design of a High Performance Error Amplifier for Switching Power Supply PAN Fuyue， LI Xiankun11（21）

A High-Performance CMOS Bandgap Voltage Reference YANG Xiaolei， ZHANG Qinfeng， JIANG Yingdan11（26）

The Design of a Frequency-tuning Circuit with Temperature Compensation Used in C-Band Radio Altimeter XIA Mou， XIA Yongping， WEI Bin， YANG Bin11（30）

Research Multi-CORE Base on Network on System Technology ZHAO Baogong， XU Yujie， QU Lingxiang11（34）

Efficient Trimming Design of the Multi-Site TestZENG Xiangjun12（16）

A/D Signal Process and AnalysisXIE Lili， CHEN Yang12（20）

The Single Events Effects Monitoring System of FIFO SRAM LIU Yongcan， PAN Bin， LI Aiping12（23）

CAN Protocol Chip with Low Voltage and High Reliability WANG Shufen ， SHAO Jian ， GUI Jianghua12（27）

Device Fabrication & Reliablity

500 V LDMOS DevelopmentCUI Jinhong， SHI Jincheng1（36）

Research Progress and Development Trends of Glass Used in Electronic Paste YU Shouyu， FU Renli， ZHANG Jie1（41）

The Research on Several Manufacturing Methods of SRC Area of Planar VDMOS MA Wanli， WEN Zhengfeng2（36）

Effects of ZnO and V2O5Co-doping on Properties of （Zr0.8Sn0.2） TiO4Ceramics YU Xuan， QIN Wangyang， JIA Lufang， QIAN Ying， DING Dong2（40）

Thermal Analysis of Power Amplifier and Structural Optimization Design of Heat Sink SHENG Zhong， CHEN Xiaoqing2（44）

Design and Simulate of High Voltage S-J VDMOSFETYANG Yongnian3（29）

Study of Metal to Metal Antifuse Cell Programming Characteristics WANG Yinquan， LIU Guozhu， XU Haiming， ZHENG Ruocheng， HONG Genshen3（35）

Impact of Barrier and Well Widths on Negative Differential Resistor Characteristic of Symmetric Double Barriers RTD Based on GaAs/AlGaAs MENG Xiao， ZHANG Haipeng， LIN Mi， YU Yuxin， NING Xiang，LV Weifeng， LI Fujiao， WANG Lidan， YU Liyang， WANG Bin3（38）

The Latest Development and Preparation of Many Elements Codoping YAG Phosphors YOU Yajun， GUAN Rongfeng4（32）

Effects of ZnO on Properties of BaSm2Ti4O12Ceramics YU Xuan， XIE Guangchao， QIN Wangyang， JIA Lufang， CHEN Bo4（36）

The Effect of Total Dose Radiation in 0.5 μm PD SOI CMOS Device XIE Rubin， WU Jianwei， HONG Genshen， LUO Jing， CHEN Haibo4（41）

2D Simulation of Single Event Burnout in IGBTWANG Xunyang， PAN Jianhua， CHEN Wanjun5（28）

Research of Polycrystalline Silicon Resistance Processing Monitor and Influencing Factor ZHANG Shiquan， MA Huihong， WU Xiaodong5（33）

A Rapid Extraction Method of SOI Device Model Parameters Based on the Total Ionizing Dose Radiation EffectLI Yanyan， GU Xiang， PAN Bin， ZHU Shaoli， WU Jianwei5（36）

The Challenge of Radar Precision Electronics Automation ManufacturingNI Jingwei5（41）

Research on the Mechanical Shear Property of Microbumps with one Sn Grain WANG Bo， CHEN Shijie， ZHU Jinzhuan， XIA Weisheng， ZHANG Jiabo， HE Man6（32）

The Affection of TID on MTM Anti-fuse UnitWANG Xu， ZHENG Ruocheng， XU Haiming6（35）

Process Optimization to Improve Anti-program Disturb Performance in Split-gate Flash ZHOU Ruling， ZHANG Qingyong7（33）

Processing of the Suspended Micro-structure Based on Bulk Silicon MEMS Technology LIU Xiaolan， ZHU Zhengqiang， DANG Yuanlan， XU Yaxin7（37）

Technology Research of T/R Component of L Band Based on FerroA6M HUANG Xulan， JIA Shaoxiong， TIAN Liang7（41）

Research and Design of High Voltage LDMOS with Single Layer Floating Field Plate Structure WEN Shuai， QIAO Ming8（34）

The Research on Several Manufacturing Methods of PIP Capacitor in CMOS Process WEN Zhengfeng， ZHAO Wenkui， FANG Shaoming8（38）

The Research of the Process on the 6-inch P-type Silicon Epitaxial Wafer with High Uniformity LV Ting， LI Mingda， CHEN Tao9（36）

Improved Design of Radiation-Hardened Flip Flop in 0.13 μm Technology LI Xiaorong， ZHOU Xinjie10（26）

The Past， Present and Future of Moore's LawDAI Jinwen， MIAO Xiaoyong10（30）

One Solution to Improve Peripheral Gate Oxide Degradation in Flash by Tunnel Oxide Nitridation Engineering LI Shaobin11（39）

A Design Method of Device Parameters of SRAMXU Zheng， LI Hongzheng， ZHAO Wenbin11（43）

The Tight Control of Tolerance of LTCC Resistor JIA Shaoxiong， LI Jun， HUANG Xulan， YANG Wei， WANG Liang12（30）

Discussion of SiGe BiCMOS Technology Process IntegrationLI Hongzheng12（34）

Thermal Analyze and Research of High Integrated T/R Module ZHOU Jun， LIU Wei， SHENG Zhong， SHEN Ya12（38）

Products & Application & Market

Design of Smart Home Devices Based on ZigBeeLI Qi， QIN Huibin， ZHANG Xiong3（44）

Indigenous Application of Ammonia Solution and Hydrogen Peroxide MA Huihong， WU Xiaodong， GU Aijun4（46）

Risk Identification of IC R&D Projects Based on WBS-RBS MatrixSUN Hua， HUANG Wei5（45）

The Sensor Monitor Module Design of the Fire Equipment Power Monitoring System HE Rongrong， HU Weiwei， ZHENG Liang6（39）

Ethernet Multi-test Data Monitoring System DesignCAI Chenxi， QIN Huibin6（44）

High-current Electric Vehicle Battery Charging System's Current and Voltage Sampling Circuit Design ZHANG Danyang， QIN Huibin7（44）

Based on Ajax Technology of Smart Home Control PageWANG Tong， QIN Huibin， HU Yongcai8（44）

Error Analysis in Beidou Receiver PositioningZHANG Ming， Gu Xiaoxue9（40）

The Design of Electronic Fan based on ZigBeeNIE Chuan， QIN Huibin9（44）

The Realization of a Positioning and Tracking System Based on BD2 Satellite XIA Yongping， XIA Mou， HAN Liujun10（35）

Design of a Data Sinking and Storingnode for Wireless Sensor Networks Based on USB WANG Yajun， YU Zhiguo， GU Xiaofeng10（39）

Grain Insect Monitor Based on Image Sensors and Wireless Sensor Networks YANG Peikai， SHI Xiong， LI Lin10（44）

Design of Intelligent Socket Based on MSP430ZHU Xiaoliang， ZHAO Lingna12（43）